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Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle

Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
Solder Flux Paste MCN225 No Cleaning Syringes with Needle for BGA Repair CPU Disassemle
  • Stock: In Stock
  • Model: ST22007542
  • SKU: ST22007542
$11.99
Ex Tax: $11.99

Available Options

Features :

New technical support, unique chemical formula provides excellent wetting, to ensure high reliability.
Use of efficient energy thixotropic agents, printing and preheating collapse, special solder ensure a good printing and fine pattern can be effectively prevented.
More advanced insulation technology, tack lasting, easy to change to dry, the viscous time up to 48 hours or more.
Specification :

Model Number: MCN-225
Particle Size: 25-48μm
Package includeds :

1 x MECHANIC Solder Flux Paste
1 x Needle

Details pictures :


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MECHANIC-Solder-Flux-Paste-MCN225-No-Cleaning-Syringes-with-Needle-for-BGA-Repair-CPU-Disassemle-1319022-10

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