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Description : 10cc Repair Tool Solder PCB SMD Soldering Paste Flux Grease Specification : The Solder Paste is a high viscosity no-clean flux , it can be used for PCB , SMD, reworking, it can be used for soldering and reballing of computer and phone chips. It is the mixture of high-qualit..

Features:    1. Made of no acid soldering flux, semi solid which is not easy to dump.2. Have strong oxide removal effect to gold-copper alloy substrate and Wire.3. Strong welding power, joint high intensity, low residual.4. This flux have stable performance and low volatility, long u..

Features:Lead-free. Melting Point: (A)138℃ / (B)183℃ Net Weight: 50gPackage Included:1 x Lead-free Low Temperature Solder PasteDetail Pictures:..

Features : Long service life and durability. With 11 needles. Application: Soldering  Specification : Material: Plastic Color: White Capacity: 30mL/50mL  Package includeds : 1 x Rosin Bottle 11 x Needle  Details pictures :..

Description: 3Pcs Kester-186 Pen With Rosin flux FPC PCB Plate Welding Repair This is Kester Rosin Pen. Designs for easier soldering of tab wire to solar cells. Superior fluxing ability. Flux flows smoothly and evenly for consistently secure and uniform solder connections with no mess. Ro..

Features:The shape is similar to the butter-like paste. High bond strength, PH value neutral, insulation resistance, welding surface smooth.No poison no corrosion, IC and PCB for no corrosive. Smooth welding surface. Good insulation. Fluxing excellent results, joint high intensity.   Specifi..

Description:5Pcs Kester-186 Pen With Rosin flux FPC PCB Plate Welding RepairThis is Kester Rosin Pen. Designs for easier soldering of tab wire to solar cells. Superior fluxing ability.Flux flows smoothly and evenly for consistently secure and uniform solder connections with no mess. Rosin resi..

Features:High bond strength, PH value neutral, insulation is strong, welding surface smooth.IC and PCB for no corrosive.Its boiling point only slightly higher than the melting point of the solder.For mobile phones, PC cards and other sophisticated electronic chip-level help welding. ..

Features:Good moisture retention.High purity.Bright color.The tin point is rounded. Type: A: Medium Temperature B: Low Temperature Package Included:1 x Medium Low Temperature Tin PasteDetail Pictures:..

Features :-Pure color, no impurities.-Good activity, strong viscosity and good fluidity.-High insulation resistance, suitable for precision electronic maintenance such as mobile phone motherboards, cpu repair.Specification:Type: Flux PasteDIY Supplies: ElectricalMod..

Features:1. This UV Solder Resist is used to protect PCB traces from corrosion2. Application: Mobiles phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etcSpecification:Viscosity: 2(Pa·S)Graininess: 2(um) weight: 0.1gPack..

Specification: Model XGSP30 XGSP50 XGSP80 XGSP200 XGSP250 Type A B C D E Melting Point 183℃ Net Weight 20g 42g 60g ..